Used OKAMOTO SVG 502 MK II #9145027 for sale

OKAMOTO SVG 502 MK II
ID: 9145027
Back grinder.
OKAMOTO SVG 502 MK II is a complete wafer grinding, lapping, and polishing equipment designed for high precision applications. The system consists of a 5 axis CNC contouring unit, a computer-monitored grinding motor, and an integrated vacuum transfer machine. The CNC contouring tool is configured with a 500mm stroke range moveable spindle head for precise profile grinding, edge grinding, and surface profiling. The high precision computer-monitored grinding motor is capable of achieving ultra-smooth surface finishes. The integrated vacuum transfer asset is used to securely retain and accurately distribute abrasive media for various grinding applications. The model is constructed with automated dual abrasives and surface finishing processes for consistent results. The equipment is designed to provide both high quality fabrication and specific tolerances for wafer substrates. It is equipped with a total of three adjustable clamps to secure wafers during the grinding and lapping process. The wafer sled is also adjustable, allowing users to program exact wafer movements and further achieve precise results. Additionally, the system is controlled by OKAMOTO CNC flow control software, allowing for complex grinding and profile operations. SVG 502 MK II also features a high pressure filtration unit for the wet media that is being used during grinding and lapping processes. The filtration machine is also configured to conduct an automatic cleaning cycle after every 40 minutes of operation. This filtration tool ensures that only clean abrasive media is applied during production and removes any potential contamination from the wet media. The asset also has the capability to detect and eliminate trapped air bubbles. Lastly, OKAMOTO SVG 502 MK II is equipped with a cooling model that can be used to maintain a constant temperature in both the grinding and lapping chambers. This cooling equipment helps to prolong the lifespan of machinery parts and prevent overheating material, ensuring consistently accurate results.
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