Used OKAMOTO SVG 502 MK II #9275350 for sale

OKAMOTO SVG 502 MK II is a state-of-the-art wafer grinding, lapping and polishing equipment designed for precision operations on pieces of 2"- 4" in diameter. It offers a high degree of accuracy and consistency in the surface finish of the finished product. SVG 502 MK II is equipped with a variety of features to make it suitable for a wide range of applications, including grinding, lapping, and polishing. Its features include a spindle drive system driven by two motors, a double-sided work table feature for quick setup and changeover, planetary gear reducers, a load cell link to monitor and control the process, and a diamond-coated grinding wheel. These features ensure OKAMOTO SVG 502 MK II is able to handle a wide range of wafer grinding, lapping and polishing applications with precision and consistency. SVG 502 MK II uses a number of different devices to control the quality of the finished product. It is fitted with a QM-INFRA digital controller, which provides a high level of accuracy and precision for the process. The unit also utilizes an image recognition unit that can detect the size, shape and condition of the wafer, enabling it to determine the ideal grinding parameters and adjust the process accordingly. Furthermore, the unit is also equipped with a spindle speed control mechanism that regulates the speed of the grinding wheel according to the type of wafer being processed. OKAMOTO SVG 502 MK II also has a variety of safety features in place, including an anti-static machine, enclosed coating, and dust filters. These features ensure safe operation when working with hot or hazardous materials, protecting both the operator and the wafers being processed. Overall, SVG 502 MK II is a reliable and high-performance tool for wafer grinding, lapping and polishing applications. With its automated functionality, high level of accuracy, and a range of safety features, it's an ideal asset for a variety of complex processes.