Used OKAMOTO SVG 502 MK II #9410491 for sale

OKAMOTO SVG 502 MK II is a highly advanced wafer grinding, lapping and polishing equipment capable of achieving superior results. This system leverages water-based, closed-loop slurry technology to deliver superior surface quality and controlled dimensional accuracy. The whole unit is equipped with a powerful 500 W/25K rpm brushless AC spindle motor, making it suitable for even the most demanding applications. SVG 502 MK II is capable of accepting substrates up to 12" in diameter and includes four main components: the mainframe, the grinding section, the lapping section, and the polishing head. The mainframe of OKAMOTO SVG 502 MK II is a sturdy and stable platform designed to accommodate the included grinding and lapping/polishing components. It also provides adequate cooling and protection to the components within. Additionally, the mainframe is equipped with precision spindle bearings and linear guides, allowing for controlled and repeatable motion for the ultimate grinding, lapping, and polishing performance. The grinding section of SVG 502 MK II is designed for maximum precision. It utilizes a two-stage mechanical grinding process to achieve ultra-fine surface finishes with superior yield strength and reduced material distortion. The machine also can be equipped with a piezo-driven end effector for ultra-precise grinding control during the final stages. The lapping and polishing section features a variable speed, water-cooled spindle motor with PLC-controlled speed, pressure, and stroke settings to maximize process control. It is further equipped with precision linear slide bearings, allowing it to produce parts with controlled flatness and roundness. The lapping/polishing head is outfitted with special lubricants for improved slurry performance and reduced burring/clogging during processing. OKAMOTO SVG 502 MK II tool has a broad range of adjustability and programming functions, allowing for tailor-made performance to match specific customer requirements. It is suitable for many applications ranging from silicon wafer thinning to the fabrication of optical components. With its advanced technology, SVG 502 MK II is the ideal choice for high-precision grinding, lapping and polishing projects - making it an excellent tool for the modern engineer.