Used OKAMOTO SVG 502 #9069021 for sale

OKAMOTO SVG 502
ID: 9069021
Wafer Size: 5"
Grinders, 5".
OKAMOTO SVG 502 is a state-of-the-art wafer grinding, lapping, and polishing equipment specifically designed for grinding, lapping, and polishing of a wide variety of substrates, such as magnetoresistive sensors, MEMS, components, and semiconductor wafers. The system is ideal for the production of complex multi-layer electronic devices. At the heart of the unit is OKAMOTO innovative and patented spindleless wafer grinding machine, which produces excellent surface finishes and minimizes the stress on the wafer. The tool is capable of grinding various materials including non-precious metals, glass, sapphire, ceramics and composites. Grinding rates of up to 20,000 rpm are achievable, with a minimum grinding step size of less than 1 micrometer. The grinding wheel is made from diamond-impregnated graphite and is designed for high precision and to eliminate the need for lubrication. SVG 502 also integrates a precision lap plate, for lap and polishing applications, with the same diamond-impregnated graphite construction. The lap plate is designed to provide precise surface finish with minimal stress on the wafer. Polishing rates of up to 1200 rpm are possible and lap plate rotational speeds of up to 3000 rpm can be achieved. The asset is also fitted with an integrated vision model, allowing for visual inspection of the grinding and polishing process for further quality control. The vision equipment can be used for in-process quality control, as well as for post-processing defect detection. Overall, OKAMOTO SVG 502 is a versatile system that can perform a variety of grinding, lapping, and polishing operations on a wide variety of substrates. Its combination of speed and accuracy provide its users with the perfect tool for their applications. Moreover, its integrated vision unit ensures the quality of the finished product is maintained.
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