Used OKAMOTO SVG 502 #9158748 for sale

OKAMOTO SVG 502 is a sophisticated and efficient grinding, lapping, and polishing equipment tailored to the demands of the semiconductor industry. SVG 502 is a versatile bench top system suitable for use on wafers and small substrates, with automation capabilities due to its design and size. The machine is designed with an integral cooling unit to keep the grinding temperature constant. This machine utilizes fan-cooled motors with air cooling across the grindstone to maintain the optimal temperature for grinding and polishing processes. Additionally, the tool has a choice of energizing the grindstone motor to optimize the grinding and polishing process of the unit. The grinding and polishing process is regulated by a precise Control & Management Asset. This model can be customized with several specialized programs to increase the efficiency of the process, along with the installed automation. To increase the efficiency of wafer polishing, the equipment includes a high-precision separator and is equipped with a safety system to prevent any damages to the environment caused by the machine. Additionally, the unit is loaded with a number of specific options. These include a Chemical Spray Control option, an Auto Batching option, as well as a vibration control machine. These options are especially useful when polishing or grinding wafers and can even speed up the process. The tool is also equipped with a specialized cleaning asset, which uses specially designed energy and media separators and centrifugal separators to clean any residue produced during the process. This is an essential model, as it prevents any damage to the grinding and polishing stones caused by residue. Finally, OKAMOTO SVG 502 is designed with a user-friendly Operational Interface to regulate each bit of the process. This cutting edge interface enables the user to monitor each step of the grinding, lapping, and polishing process with precision and accuracy. SVG 502 is a pioneering equipment for wafer grinding, lapping and polishing. Its automated and precise design makes this system highly appropriate for industry applications and is tailored to meet the demands of the modern semiconductor industry.