Used OKAMOTO SVG 502 #9158759 for sale

ID: 9158759
Vintage: 2005
Wafer back grinder 2005 vintage.
OKAMOTO SVG 502 is a high-performance wafer grinding, lapping and polishing system manufactured by OKAMOTO Corporation. This system is designed to provide ultra-precise machining of large-diameter hard and soft materials. SVG 502 is capable of processing two- and four-inch wafers. The precision achieved on the wafer surfaces is ensured by the high-quality spindle which allows for extreme accuracy and repeatability. The mechanical design of OKAMOTO SVG 502 makes it suitable for intense grinding and polishing activities. It features a robust castiron base with steel overlay components for long-term reliability. The spindle is driven by a 30 kW direct-drive motor with built-in torque vectoring capability. The maximum grinding speed at 100 mm off-set is 13,200rpm with an acceleration of 2,200rpm/s. The machine is operated through an easy-to-use touchscreen interface that features a graphical user interface and built-in recipe editing capability. SVG 502 uses OKAMOTO proprietary DAF technology (Diamond Abrasive Film) for wafer processing. DAF is an abrasive film system that is used to achieve ultra-precise machining of hard materials for great detail. The DAF assembly includes a deburring diamond abrasive sheet and a sheet of paper. The number of sheets used depends on the material to be machined and the wafer's diameter. After cutting, the sheets are removed from the substrate and replaced with a new set when the desired result is achieved. The DAF sheets are mounted onto the wafer grinding wheel which turns at a determined speed. RPM and load are meticulously monitored to achieve the desired level of precision. The lapping and polishing stages are used to create the smooth surface finish. The grinding, lapping and polishing stages are done in sequence. The process generates small slurry on the wafer surface so that is removed by the polishing stage in the final step. The overall process is made up of a series of distinct steps, all of which are highly accurate and highly repeatable. The high-precision, high-repeatability nature of OKAMOTO SVG 502 makes it ideal for the manufacturing of very large-diameter wafers. The end result is a smooth and uniform surface on the wafer that ensures superior seal integrity.
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