Used OKAMOTO SVG 502 #9191396 for sale

OKAMOTO SVG 502 is a wafer grinding, lapping, and polishing equipment uniquely crafted for precise, accurate, and uniform surfaces. It is highly sought after tool in the semiconductor industry as its design ensures the micro-processing of substrates of up to 2" in diameter. It is ideal for a variety of materials including Silicon, GaAs, and Sapphire. SVG 502 system utilizes an adjustable spindle design along with multiple grind-heads for efficient process control and reliable production. The valve-controlled spindle uses a range of rotational speeds which efficiently controls the grinding and polishing speeds to produce surface uniformity. The spindle is coupled with an advanced grind-head that uses different diamond grits to precisely predict and control the surface treatment. To ensure precise and uniform surfaces, the grind-head is smartly fixed with replaceable diamond tip holders. The unit comes with a top and bottom diamond feed machine which allows simultaneous supply of the diamond grit to top and bottom of the substrate. This innovation ensures that the grits are spaced appropriately and provides uniform treatment of the substrate surface. Additionally, the grind-head has a tablematic grind-head head which oscillates at 180-degrees which helps in accurate lapping of the substrate. The machine has a robust build quality and is equipped with an advanced safety feature which shuts down the machine if the external pressure exceeds the permissible level. This ensures all the safety measures while operation. Moreover, the machine is provided with video and image capturing systems that help in closely monitoring the steps taken. In conclusion, OKAMOTO SVG 502 is an invaluable asset for the semiconductor industry. Its precision, uniformity, accuracy, and robust build quality make it stand out among its competitors. The tool also requires minimum maintenance and is easy to install, making it the perfect choice for micro-processing of substrates.