Used OKAMOTO VG 502 MK II #176849 for sale

OKAMOTO VG 502 MK II is a state-of-the-art automatic wafer grinding, lapping, and polishing equipment, designed to produce superior-quality surfaces on single- or double-side wafers. The system is well suited for both laboratory and production-level applications, providing excellent accuracy and repeatability. The unit features an advanced workpiece handling machine, which includes a variety of center wheel types, pallet rings, and a unique vacuum chuck interface. This makes it possible to quickly set up processing operations and allows for a variety of wafer sizes and types. The tool also features an automated load/unload asset, which enables fast sample processing and ease of operation. OKAMOTO VG 502 MKII is equipped with a broad array of grinding, sealing, lapping, and polishing tools. It has a high-precision direct-drive linear motor with a feed-back control model, which ensures uniform grinding and lapping operations. It also offers fine-adjustment settings for the grinding and polishing of both single- and double-side wafers. The equipment also utilizes a closed-loop temperature control system, which ensures consistent temperature-based polishing results over a wide range of wafer and tool geometries. The unit also features a class 10 cleanroom-compatible environment and filter machine, making it suitable for use in semiconductor and MEMS manufacturing processes. VG 502 MK II has been designed with an easy-to-use user interface, which enables simple setup and operation. Its 24-bit graphical display provides a high level of visualization, making it easy to monitor the process step-by-step. Additionally, the real-time data displays allow users to easily monitor the process from their workstation. Finally, the tool integrates with OKAMOTO maintenance and diagnostics software, allowing users to easily identify problems and diagnose any issues. The asset features an event logging model which can be used to monitor and track the process over time. The equipment also comes with a number of advanced features, such as enhanced user-selectable processing modes and a variety of grinding and polishing options. Overall, VG 502 MKII is an advanced and reliable wafer grinding, lapping and polishing system. With its various grinding and polishing capabilities, combined with its versatile workpiece handling and automated features, the unit offers a complete solution for achieving superior wafer surfaces.