Used OKAMOTO VG 502 MK II #189317 for sale

OKAMOTO VG 502 MK II is a highly advanced semiconductor grinding, lapping, and polishing equipment. It is designed for use in multi-step process applications such as wafer grinding, lapping, and polishing. OKAMOTO VG 502 MKII features a range of process parameters including grind rate, end point control, displacement of grinder, and more. VG 502 MK II is equipped with two independent grinding and lapping spindles. The main spindle provides a way to control the grinding process and features a diaphragm dresser and an end-of-grind sensor. The secondary spindle provides a second line of grinding and lapping functions, resulting in a more precise process control. The grinding process can be controlled precisely by the computer, which allows for accurate and consistent results. The grind rate, end-point control, and other aspects of the process can be easily adjusted by entering the desired values into the system. VG 502 MKII also includes a polishing head capable of controlling the distribution of polishing fluid during the polishing process. This ensures an evenly polished surface, resulting in higher yields. The polishing head is also capable of controlling the speed of the polishing wheels, providing a more consistent finish. OKAMOTO VG 502 MK II is equipped with a host of features, including a vacuum unit for collecting grinding dust, a cooling machine, and automatic loading of grinding spindle. The protection shields and covers reduce the risk of personal injury when the tool is in operation. OKAMOTO VG 502 MKII is a game-changing tool for semiconductor fabrication. It provides a comprehensive solution for a wide range of process applications, resulting in high yields and precise results. Its sophisticated design makes VG 502 MK II ideal for use in the most demanding wafer grinding, lapping, and polishing applications.