Used OKAMOTO VG 502 MK II #293594531 for sale

OKAMOTO VG 502 MK II is a state of the art wafer grinding, lapping and polishing equipment designed to provide precision polishing of a wide range of substrates. The system consists of a polishing arm, micrometer, lapping plates, and polishing slurries. The polishing arm supports a diamond-grinding wheel and a polishing cloth, allowing for grinding and polishing of 6-inch and 8-inch wafers, up to a maximum of 12-inch diameter. The adjustable micrometer ensures accurate positioning and enables precise fine-scale control of the position of the grinding wheel and polishing cloth during polishing operations. The lapping plates have extremely flat surfaces with grooves to ensure minimum wear of the wheel and maximum efficiency of the polishing process. The grooves also provide a stable contact surface between the polishing cloth and the wafer, resulting in a uniform, smooth finish. The polishing slurry acts as a lubricant and abrasive, providing a uniform surface finish. The polishing slurry is available in two grades, medium and fine, allowing for different finishes on the wafer. OKAMOTO VG 502 MKII utilizes a vacuum chuck to hold and secure the wafer during grinding and polishing operations. The vacuum chuck is made up of an arrangement of high-strength polyurethane discs allowing for maximum contact with the wafer and preventing slippage. The vacuum chuck also ensures that the wafer is secured and prevents it from moving during grinding and polishing operations. This machine is designed for operation in either manual or automatic modes. In the manual mode, parameters such as feed rate, wheel speed, polishing time, and polishing pressure need to be manually set. The automatic mode allows for preset programs to be used, and is ideal for production runs as it increases accuracy and reduces the time spent on changing parameters. VG 502 MK II features a safety interlock unit that is designed to prevent accidental activation of the machine. In addition, an alarm is activated if the operating parameters are exceeded, in order to prevent damage to the wafer as well as the grinding and polishing tool itself. VG 502 MKII also comes with a range of accessories, such as a dust hood and air filter, to ensure that the wafer and the grinding and polishing asset are kept clean during operation. It also includes a water-cooled grinding wheel, coolant, and a grinding cloth and filter disc to ensure that the grinding and polishing process is kept as cool as possible. OKAMOTO VG 502 MK II is a top-of-the-line, precision wafer grinding, lapping and polishing model, ideal for high-end, precision polishing of a variety of substrates. The equipment is designed, built and tested to the highest standards, and it offers reliability, accuracy, and repeatability of grinding and polishing processes. Thanks to its advanced features and accessories, OKAMOTO VG 502 MKII is perfect for grinding and polishing of the most challenging substrates such as sapphire, silicon and various other materials.