Used OKAMOTO VG 502 MKII 8 #293636735 for sale

OKAMOTO VG 502 MKII 8 wafer grinding, lapping and polishing equipment is a high precision and cost-effective solution for the production of flat and parallel wafers used in semiconductor and microelectronic production. This system features an 8 inch (203 mm) workpiece capacity, making it ideal for grinding, lapping and polishing a wide range of wafer sizes. The unit also features an efficient vacuum machine that provides a clean, dust and dirt-free workpiece surface even at high speeds. OKAMOTO VG-502 MKII 8 offers maximum rigidity and improved stability, thanks to the machine's spindle and vibration-reducing features. The spindle is designed to reduce heat build-up as it rotates, preventing overheating and leading to more efficient grinding, lapping and polishing. The vibration reduction feature helps to reduce noise emitted from the tool, making it an ideal choice for use in workshops, factories and other environments where noise may be a concern. VG 502 MK II 8 includes a high-precision linear motion guide that ensures a smooth and responsive feed rate, and offers a maximum feed speed of 50 mm/s. This asset is capable of grinding, lapping and polishing with precision, with a maximum material removal rate of 6 microns per pass. The grinding discs used with this model are designed to both remove material and protect wafer edges, ensuring a high-quality, burr-free finish on each wafer. OKAMOTO VG 502 MK II 8 is equipped with a manual lubrication equipment, which allows quick, easy and accurate lubrication of the spindle, ensuring long-term performance and preventing damage due to friction or heat. This system also features an advanced automated tool monitoring unit designed to alert the user when a new grinding disc is needed or when a tool needs repair. This reliable and user-friendly machine complements its accurate and cost-effective performance by offering a wide range of optional accessories and attachments to meet specific user needs. With its user-friendly design and intuitive operation, VG 502 MKII 8 is an effective solution for efficiently grinding, lapping and polishing wafers in the production of quality products.