Used OKAMOTO VG 502 MKII 8 #293804366 for sale

OKAMOTO VG 502 MKII 8 is a wafer grinding, lapping and polishing equipment designed for semiconductor fabrication. It is suitable for processing multi-layer semiconductor wafers with a diameter of 8 inches (200 mm). The system is equipped with an 8-inch grinding wheel and two 8-inch Bob Gust Type lapping rolls. The grinding wheel features an adjustable workpiece speed with a range of 0-30 m/sec, while the lapping rolls operate at up to 6 m/sec. The unit has a 3-axis stage and a motorized elevation machine for precise material removal. OKAMOTO VG-502 MKII 8 utilizes a single linear motor for high speed and precise positioning. The tool has a maximum acceleration of 4500 mm/sec2 and a repeatability in the X-Y plane of 0.02 μm. It has a working area of 140 x 140 mm, with a movement range of 1150 x 2550 mm. The asset is fitted with multiple process monitoring features to ensure optimal performance. The model monitors surface quality, vibrations, wheel speed, wheel diameter, wheel pressure levels, wheel head temperature and pressure, surface form and wafer eccentricity. The equipment is designed with a multiple head loading facility, enabling simultaneous processing of up to eight wafers. A DC motor and gear mechanism ensures smooth rotation of the wheel head. VG 502 MK II 8 has an easy to use graphical user interface to program different parameters and process steps. The system is equipped with a PLC-based control circuit for setting parameters such as grinding wheel rpm, feed rate and wheel pressure. The unit is capable of performing fast and accurate wafer grinding, lapping and polishing operations. It is available with an optional in-situ cleaning machine for keeping the grinding wheel clean. The tool requires minimal maintenance, and includes built in safety features to protect the user from accidental contact with the grinding wheel.