Used OKAMOTO VG 502 MKII 8 #293831496 for sale

OKAMOTO VG 502 MKII 8 is a multi-purpose wafer grinding, lapping, and polishing equipment designed for semiconductor device manufacturing and assembly. This system is able to handle a variety of complex processing tasks, from wafer thinning and lapping, to grinding, polishing, and various CMP (Chemical Mechanical Planarization) processes. OKAMOTO VG-502 MKII 8 provides a modular design that is capable of handling a wide range of substrates, such as Si, GaAs, and InP, for R&D and production applications. VG 502 MK II 8 incorporates two tool heads in one modular unit: a wafer grinding/lapping head and a polishing head. Each head is driven independently via robust, high-speed brushless DC motors and precision spindles, which provide a stable base during operation. In addition, the rotating spindles achieve high rotational speed of up to 14,400 rpm. This high-speed stability enables minimal slippage and extreme uniformity in the polishing process. VG 502 MKII 8 is controlled via a 6-axis industrial robot, which is capable of executing complex patterns to meet the desired accuracy. It is also equipped with an intuitive Windows-based GUI (Graphical User Interface) that provides a user-friendly experience. Furthermore, the graphics capability of the unit allows for the visualization of the wafer profile throughout the wafer grinding, lapping, and polishing process VG-502 MKII 8 is a highly reliable and versatile machine that is compact, efficient, and durable. It is designed to meet the highest requirements for process performance, with a high-precision miniature tool and media feeder that ensures an accurate processing of wafers. The tool is capable of handling 150 and 200mm wafers with both single-side and two-side grinding, and it can reach a maximum pitch variation of just 2 microns. Furthermore, the media replenishment asset guarantees uniform wear of the tools on the surface of the wafers, ensuring a consistent high quality. In conclusion, OKAMOTO VG 502 MK II 8 is an advanced, highly efficient wafer grinding, lapping and polishing model that provides consistent results while handling a wide range of substrates. Its modular design offers flexibility, while its Windows-based GUI, 6-axis industrial robot, and miniature tool and media feeder ensure consistent performance. With its accurate pitch variation of just 2 microns and efficient media replenishment equipment, OKAMOTO VG 502 MKII 8 is a dependable solution for advanced semiconductor device manufacturing and assembly requirements.