Used OKAMOTO VG 502 MKII 8 #9022071 for sale

OKAMOTO VG 502 MKII 8 is a state of the art wafer grinding, lapping, and polishing equipment. This versatile machine is designed for grinding, lapping, and polishing both semiconductor and optical wafers. It can work on wafers up to 8 inches in diameter and can handle a wide variety of materials including magnetic, optical, and semiconductor-based materials. OKAMOTO VG-502 MKII 8 utilizes a cutting edge, high-speed, dual spindle design that is capable of achieving ultra-precise, rapid, and repeatable grinding, lapping, and polishing processes. Its controlled speed ranges, precise repeatability, and accuracy of the grinding and polishing processes make it ideal for high performance and robust grinding, lapping, and polishing operations. The system also comes equipped with a patented air bearing spindle technology that provides extra fine accuracy and repeatability. This ensures a consistent finish across the surface of the wafer and eliminates deformation. The air bearing also helps to reduce the vibration levels of the unit for a more consistent grinding and polishing operation. The machine also comes with electronic diagnostics and monitoring capabilities for optimizing the machine's performance. This enables operators to get real-time updates on process status, temperature, and other important parameters to ensure a high quality and repeatable grinding and polishing process. VG 502 MK II 8 also utilizes automated programming with its embedded control tool. It uses multiple programs that are defined online or downloaded from a host PC. The entire asset is capable of monitoring the conditions of the wafer surface throughout the entire grinding and polishing process. In addition, the model also comes with an integrated cooling equipment that enables improved processes stability and accuracy. The cooling system helps to maintain an optimal grinding and polishing temperature and can be adjusted based on the material being processed. All in all, VG 502 MKII 8 is an elite high-precision wafer grinding, lapping, and polishing unit. With its advanced design, high-speed, dual spindles, precise repeatability, and excellent process capabilities, OKAMOTO VG 502 MK II 8 is a leader in the industry for wafer grinding, lapping, and polishing technology.