Used OKAMOTO VG 502 MKII 8 #9028594 for sale

OKAMOTO VG 502 MKII 8 is a robust and high powered automatic wafer grinding, lapping and polishing equipment designed for precision and efficient processing of a wide variety of wafers. The system features a built-in, programmable logic controller (PLC) that allows for full automation for efficient operation. Its 8-inch wafer capacity allows for multiple wafers to be processed simultaneously. It features an easy-to-use and intuitive user interface for optimizing grinding and polishing processes. The unit has a highly efficient grinding wheel to process the wafer's edge profile quickly and accurately. The lapping arm is down-weighted and dynamically balanced to provide stable lap rotation and uniform stock removal. A magnetic liquid jet edge sensor (MLJS) continuously monitors the amount of stock removed throughout the entire process. The unit comes with the latest technologies to ensure a complete and uniform finish. It uses a highly durable and wear-resistant granular diamond surface to minimize wafer breakage. Vacuum chucking provides accurate positioning and stable grinding. OKAMOTO VG-502 MKII 8's advanced features make it an ideal choice for applications involving high yield, high precision and high throughput. In addition to the main unit, the machine includes a range of accessories and components to ensure reliable operation. These include a full selection of grinding and polishing pads, consumables and cleaning solutions as well as safety equipment. VG 502 MK II 8 is a reliable, precise, and efficient wafer grinding, lapping and polishing tool that is easy to use, cost-effective, and offers a wide variety of features to ensure smooth operation and high yields.