Used OKAMOTO VG 502 MKII 8 #9036371 for sale

OKAMOTO VG 502 MKII 8 is a wafer grinding, lapping and polishing equipment produced by manufacturer OKAMOTO. This system is capable of grinding, polishing, and lapping wafers up to 8" in diameter in a single stage. OKAMOTO VG-502 MKII 8 is designed for grinding, lapping, and polishing a range of silicon wafers and substrates. The unit includes two separate spindles, a grinding spindle and a lapping spindle, each with a motor and precision control. The grinding spindle allows for precise control of the grinding force, enabling a wide range of possibilities in process development. The lapping spindle utilizes two independently motorized disks to achieve a finer finish. Both spindles are capable of rotating in forward and reverse motion to provide precise control during the process. The machine is composed of a main unit, a work table, and an integrated control tool. The main unit houses four tanks that can be used to store and circulate chemicals for post-processing needs such as cleaning and etching. The work table is made up of an X-Y axis table travel with scanning head, 3-axis digital display, and a cooled water jacket for controlling sample temperature during processing. The integrated control asset allows for precise programming and control of the processes. The machine is designed to be extremely compact and space-efficient, allowing operators to set up near the production line. This reduces manual handling of samples, as well as potential damage that could be caused by moving delicate parts. The model's controls are simple and intuitive, allowing for quick and easy setup and operation. VG 502 MK II 8 sets new standards in wafer grinding, lapping, and polishing. Its compact design and sophisticated control systems make it one of the most advanced systems available for handling wafer-level processes. This equipment can help maximize production efficiency and ensure quality wafer processing.