Used OKAMOTO VG 502 MKII 8 #9050008 for sale

OKAMOTO VG 502 MKII 8 is a highly advanced wafer grinding, lapping and polishing equipment designed for precise and efficient operation. This system has a maximum grinding wheel diameter of 250 mm, a maximum traverse speed of 60 m/min, and a compact, single-unit configuration. OKAMOTO VG-502 MKII 8 utilizes a powerful AC motor for driving the grinding wheel, which provides high torque and high accuracy with low noise and vibration. The grinding wheel is mounted on a sliding table which can be adjusted for height and holds up to 8 wheels for efficient grinding and polishing of large wafers. The automated feed and loading unit also allows for automated loading and unloading of wafers without manual intervention, increasing efficiency and reducing operator fatigue. The machine is equipped with powerful vision-based alignment systems, allowing the tool to rapidly identify and accurately align the wafers before starting the grinding and polishing process. VG 502 MK II 8 also comes equipped with advanced control systems, including a precision angular measurement asset which provides precise angular measurement data, ensuring a perfectly parallel finish on wafers. OKAMOTO VG 502 MK II 8 comes with a programmable interpolation feature, which allows the user to draw out a two-dimensional route which allows for follow up parallelism and straightness. This makes it ideal for large wafers, as it allows for a uniform finish on the entire wafer. VG 502 MKII 8 also has a built-in CCD camera for measuring surface roughness and surface characterization. This makes it easier to detect and correct defects in the wafer's surface. The model's PC-based control station is also designed to be highly user friendly, allowing the user to operate the equipment easily and efficiently. This advanced wafer grinding, lapping and polishing system is the perfect tool for production environments seeking a top-notch unit for grinding and polishing large wafers. By combining powerful motors and advanced alignment and control systems with a stable, user-friendly operating machine, VG-502 MKII 8 is the premier machine for high-precision wafer grinding and polishing.