Used OKAMOTO VG 502 MKII 8 #9169688 for sale

OKAMOTO VG 502 MKII 8 is a wafer grinding, lapping and polishing machine designed for use in the semiconductor industry. It is designed to process a wide variety of substrates, including silicon, quartz, germanium, sapphire, and silicon nitride, among others. It is equipped with precision grinding and polishing spindles, a fully-automated wafer carrier equipment and offers superior grinding and lapping performance. This system offers an array of features and can accommodate up to 8" substrate wafers. It is capable of grinding to 0.1μm or better, and of achieving high levels of surface roughness. High-level precision grinding is achieved by micro feathering of the diamond wheels with digital spin speed via an adjustable frequency inverter. The unit is also equipped with an auto-head retract function which increases re-cutting accuracy and yield during wafer processing. OKAMOTO VG-502 MKII 8 has a user-friendly operation machine with a colour graphic LCD which allows for easy operation and tool management. Asset parameters, such as grinding and polishing parameters, cutting and polishing speeds, and process sequences, can be easily adjusted and set. The operator can also set wafer temperature and particle control parameters. The model is highly reliable and easy to maintain as its spindle motors have excellent durability. The brushless motors provide high reliability and are specifically designed to allow a long service life. The equipment is also equipped with a built-in cooling system to reduce heat generated by the motors. VG 502 MK II 8 is the ideal choice for customers who require high levels of efficiency and precision. It is ideal for applications such as membrane processing, fabrication of MEMS devices, and packaging of large substrate wafers. The machine offers excellent performance and precision processing of wafers for these and many other types of semiconductor devices.