Used OKAMOTO VG 502 MKII 8 #9188638 for sale

OKAMOTO VG 502 MKII 8 is a state-of-the-art wafer grinding, lapping and polishing equipment engineered for precise and efficient production of digital memory devices (DRAMs, SRAMs, etc.) and other advanced silicon substrates. This system is built on the platform of the VG 510 MKII 8, a smaller version of OKAMOTO VG-502 MKII 8. VG 502 MK II 8 is equipped with a diamond grinding wheel with 5 ton pressure force and a polishing slurry head for precise grinding and lapping of both soft and hard materials. It is powered by a 3-phase 50 Hz motor and has a control console that enables precise adjustment of parameters. The grinding wheel features are adjustable depth of cut, speed control, track speed and micro-adjustment. The wheel is driven by a hydraulic piston providing smooth grinding and glazing. VG-502 MKII 8 also features an integrated ceramic-tungsten platen that offers the best surface finish with minimal stress and distortion. It features a combined edging and cleaning station with integrated abrasive cleaning and polishing that eliminates the need for manual cleaning. The integrated operator interface simplifies monitoring and operation while the advanced accuracy and positioning control ensures consistent results. The unit is equipped with an environmentally sealed grinding chamber that traps waste and splatter in an efficient and safe manner. An optional edging/polishing/cleaning machine helps maintain the highest levels of surface finish and eliminate the need for manual cleaning. VG 502 MKII 8 offers a wide range of advanced features for optimum efficiency and safety. It is an ideal solution for high production grinding and polishing of digital memory components, DRAMs, SRAMs and other silicon substrates. This tool enables precision grinding, lapping and polishing of advanced substrates with high repeatability and accuracy. It is a reliable, durable and cost-effective asset with wide application in various sectors.