Used OKAMOTO VG 502 MKII 8 #9217464 for sale

OKAMOTO VG 502 MKII 8 is a versatile and user-friendly wafer grinding, lapping and polishing equipment. The system uses electrostatic chuck and table to ensure proper alignment of wafers during grinding, lapping and polishing. With a spindle motor of 0.5 kW and a grinding spindle speed of up to 1600 RPM, OKAMOTO VG-502 MKII 8 can achieve high precision results across various kinds of wafers. A top-level design and well thought-out components ensure VG 502 MK II 8 is capable of achieving master-level wafer grinding, lapping and polishing. The grinding spindle is housed inside a water-cooled drive that also serves as a sound cover. A forced circulation unit helps to cool the spindle during operation. The electronic synchronization machine prevents grinding or lapping overlap, ensuring a uniform result. In addition, OKAMOTO VG 502 MK II 8 comes with a wide range of accessories and options to meet the needs of various wafer processing applications. The tool features a baking temperature control unit which automatically sets the temperature of the wafers for precise grinding and polishing results. The wafers are then placed in the in-line five-axis wafer grinders where they are automatically located and clamped. Different spindle sizes and lapping points are available to help the user achieve the desired wafer size and shape. Finally, VG 502 MKII 8 features an on-board control module which allows the user to easily monitor and control the machine operations. The user can also set grinding, lapping and polishing parameters as needed. The digital display helps the user to conveniently monitor and control each step of the wafer grinding, lapping and polishing process to ensure the best possible results. In addition, the asset is also equipped with safety features, such as emergency stop and interlock, ensuring user safety.