Used OKAMOTO VG 502 MKII 8 #9232270 for sale

OKAMOTO VG 502 MKII 8 is a wafer grinding, lapping and polishing system developed to increase yield, reduce manufacturing time and improve surface quality. It has a variety of features designed for efficient and accurate processing of various materials. With an 8-inch diameter processing area, the machine is capable of processing wafers, as well as discrete components such as flat panels, substrates and thin film polishing devices. OKAMOTO VG-502 MKII 8 features a robust design for robust results, with a rigid frame and heavy-duty construction that ensures reliable operation with minimum downtime. It also offers a range of cutting and polishing capabilities that can be tailored to a particular application. Its fully programmable design allows users to customize cutting parameters to produce high-quality results. The machine can also be equipped with a range of accessories, including an operator-friendly control unit, spindle motor, lapping plates, and grinding wheels. The lapping plates feature a unique dry or wet lapping ability, while the grinding wheels allow for a greater degree of predictability in the finished product even for complex shapes and angles. In addition, VG 502 MK II 8 is suitable for a wide range of applications and features adjustable speed settings to accommodate different materials. It is also compatible with a variety of materials, including semiconductor materials, dielectrics, ferrites and insulators. VG 502 MKII 8 offers users a high-performance, cost-effective solution for their wafer grinding, lapping and polishing needs. Its design enables high-precision processing of a variety of materials, while its robust construction and adjustable speed settings provide reliable and consistent results. With its range of accessories, its versatility is unmatched and its performance and results are unsurpassed. It is an excellent choice for any application that requires precision handling of complex shapes, angles, and materials.