Used OKAMOTO VG 502 MKII 8 #9311189 for sale

OKAMOTO VG 502 MKII 8 is a multifunctional wafer grinding, lapping & polishing equipment designed for efficient and consistent performance in the processing of Silicon, III-V and other compound wafers up to a maximum of 150mm in diameter. With its 8 station grinding wheel and option of 10 station lapping & polishing heads, it is an ideal system for the repeatable and cost-effective production of high-quality wafers suitable for use in the semiconductor, optical and display industries. OKAMOTO VG-502 MKII 8 employs a unique combination of technologies for optimal grinding, lapping and polishing. Its 8 station grinding wheel is driven by a powerful 4-pole induction motor, providing extremely smooth rotating action which minimizes dimensional errors and ensures consistent product quality. The 10 station lapping & polishing heads utilize ceramic bearings for maximum precision, and all components are temperature-compensated to ensure stable and reliable performance. VG 502 MK II 8 also features advanced safety and monitoring systems, including a two hand operation activation button to ensure safety compliance and the addition of a closed-loop feedback unit to improve the accuracy of the operation. Additionally, a machine-wide monitoring tool keeps track of operational parameters such as grinding wheel speed, pressure, temperature, and vibration to ensure consistent and reliable performance. This allows the operator to program and easily monitor the progress of each process step. VG 502 MKII 8 also features a user-friendly operator interface with a full range of settings. This allows the user to easily program and monitor the grinding, lapping & polishing processes for a range of wafer sizes and material types. Moreover, all settings and operational data can be stored for easy retrieval and comparison, making it possible to continuously monitor and adjust for optimal performance. Overall, OKAMOTO VG 502 MK II 8 is an extremely versatile and reliable multi-function wafer grinding, lapping and polishing asset. It provides repeatable and cost-effective processing for a range of wafer sizes and is suitable for use in the semiconductor, optical and display industries. With its robust construction, advanced safety systems, user-friendly interface and built-in monitoring, VG-502 MKII 8 is the ideal model for any production environment.