Used OKAMOTO VG 502 #197320 for sale

OKAMOTO VG 502 is a comprehensive wafer grinding, lapping and polishing equipment designed for the fabrication and processing of substrates such as semiconductor wafers, glass wafers, optical substrates and ceramic wafers. This sophisticated wafer processing machine features a flexible, two-step grinding/lapping/polishing process, allowing for fast and accurate substrate processing. OKAMOTO VG-502 utilizes a robust design and superior engineering in order to provide superior surface finish, high precision processing efficiency and top-of-the-line reliability. VG 502 offers a two-axis configuration allowing for fast and precise wafer grinding and lapping with its high-speed motor and spindle. This is possible due the two independent feed units, each with independent programmable control for feature-specific feeding. This enables the user to perform complex wafer process steps with high accuracy. The machine utilizes a two-stage process, consisting of a rough grinding/lapping followed by finer lapping/polishing. This can be done in both automated and manual operations or switch between them. VG-502 has a powerful grinding unit fitted with diamond grinding wheels, steel plates and abrasive belts. This is complemented by a lapping and polishing unit that enables the user to achieve the desired results. This is achieved through the use of special diamond grit media and oil lapping/polishing fluids. This ensures that the wafer processes are repeatable and tailored to one's specific requirements. OKAMOTO VG 502 also features a cleaning system designed to remove small particles and debris from the wafer surface. This cleaning unit uses liquid cleaning fluids and high-speed ultrasonic washing. An additional safety feature is the water and air-purging machine which is designed to prevent contamination during operation. OKAMOTO VG-502 offers efficient wafer production and high accuracy for complex substrate processing. With its robust design and superior engineering, the machine provides fast and precise processing capabilities suited for the manufacture and processing of small geometric objects such as semiconductor wafers, optical substrates, and ceramic wafers.