Used OKAMOTO VG 502 #293633680 for sale

OKAMOTO VG 502 is a robust and reliable wafer grinding, lapping and polishing equipment, designed for use in modern high-tech production environments. It is capable of processing up to 8-inch diameter wafers, with a maximum thickness of 12.5 mm. The lapping and polishing components of the system are built with a durable, dustproof and even dust-free construction; all of which combine to provide a high level of precision, repeatability, and productivity. The unit utilizes a series of rotating and stationary grinding or lapping heads to achieve a desired surface finish and loosen unwanted particles, while the polishing operation polishes and gives a uniform gloss to the finished surface. OKAMOTO VG-502 is equipped with up to eight grinding spindles, which support a range of single- and double-sided processing, as well as simultaneous coarse and fine grinding and/or lapping. The machine also features a cooling unit that maintains head temperatures at a consistent and stable level. Achievement of accurate wafer size and shape is facilitated by the use of a 3rd axis mill table. This allows adjustment of the wafer's position for consistent grinding, lapping and polishing results. In addition, VG 502 is adjustable within a range from 240-500 RPM and can be easily operated using a handGMO 570 / C controller. VG-502 is a reliable and robust, multi-functional tool that enables users to efficiently and effectively complete wafer lapping and polishing operations. The asset is highly capable, and even, dustproof, and dust-free construction ensures high levels of precision and productivity. In addition, adjustable speed and the 3rd axis mill table make it ideal for a variety of grinding, lapping and polishing applications.