Used OKAMOTO VG 502 #9223396 for sale

OKAMOTO VG 502 Wafer Grinding, Lapping & Polishing Equipment is an all-in-one solution for precision and semi-precision grinding, lapping, and polishing of wafers and related substrates. This high-tech system is designed to meet the challenging demands of semiconductor manufacturing operations. OKAMOTO VG-502 unit consists of a precision grinding head, integrated polishing head, vacuum machine, and a two-station rotary table, all of which are driven by a five-axis motorized CNC positioning stage. This stage offers superior precision for grinding and polishing operations and can be programmed to execute complex patterns and profiles. The polishing head is equipped with several conveniences such as the ability to switch from grinding mode to polishing mode quickly. Furthermore, the fine pitch thread ballscrews provide precise repeatability of the motion paths from one wafer to the next. VG 502 tool is capable of grinding and polishing wafers with a variety of shapes and sizes. The CNC positioning stage can accommodate wafers with external diameters ranging from two to 250 millimeters. Additionally, the asset can be programmed to grind and lap substrates with internal shaping and radii in the range of two to 250 millimeters. VG-502 includes several safety features for optimal operability such as a pressure switch that stops the model when it senses an obstruction, a light curtain safety switch around the grinding head, and a wafer break detection equipment that shuts off the system when a break is detected. Moreover, the vacuum unit comes equipped with an audible alarm machine that warns operators of a vacuum leak or other malfunctioning conditions. OKAMOTO VG 502 is a highly efficient machine, offering fast logistics, high throughput, and a high rate of utilization. It is capable of grinding five wafers simultaneously at a rate of up to 20 meters per minute. Furthermore, the machine offers compatibility with a variety of materials and chemical compounds, and the integrated wafer break detection tool can recognize breaks as small as 0.1 millimeter in size. The advanced design allows for an easy setup and quick repairs. OKAMOTO VG-502 Wafer Grinding, Lapping & Polishing Asset is capable of producing high-quality results in a short amount of time, and its integrated safety features make it an ideal solution for precision manufacturing operations.