Used OKAMOTO VG 502 #9408618 for sale

OKAMOTO VG 502 is an advanced wafer grinding, lapping, and polishing equipment designed for the production of high-grade semiconductor devices and materials. It integrates the principles of CMP, lapping, and polishing technologies to provide a production platform suitable for both high-volume production and research and development. It features an overhead spindle servo-drive system which sets the grinding wheel rotation speed with precision and thus ensures superior accuracy and superior quality. OKAMOTO VG-502 also offers a wide range of grinding wheel options with various grit materials to suit different requirements. The unit can process wafers of different sizes and materials, including silicon, germanium, III-V compounds, and GaAs compounds. This is enabled by its removable polishing chuck which holds up to eight 8" or twelve 4" wafers simultaneously and is adjustable to accommodate wafers of different sizes and shapes. The wafers are passed through a grinding wheel at defined angles and with a constant feedback loop, which measures the uniformity of grinding and automatically adjusts the grinding parameters for improved accuracy. The machine is equipped with an advanced differential lapping technique, whereby the lapping plate can be fed with a uniform continuous flow of abrasive particles. The differential lapping is then performed within the lapped area to improve surface roughness, flatness, and parallelism. Moreover, VG 502 is capable of global lapping, whereby lapping of the entire wafer is done in one pass without damaging the edges. The entire tool is controlled by a central control unit. The asset is also equipped with a temperature controlled liquid lubrication model to ensure uniform wafer temperature and improve process precision. Furthermore, an adjustable cooling equipment allows the system to vary the cooling rate and also monitor process parameters in real-time. Such features are essential in ensuring greater process stability and minimal damage to the wafers. VG-502 is the ultimate grinding, lapping, and polishing unit and provides extremely accurate and reliable results. Its wide range of process parameters, adjustable cooling rates and dedicated lubrication machine make it a preferred choice for high-end applications.