Used OKUMA GPB-350 #9093456 for sale

OKUMA GPB-350 is a wafer grinding, lapping and polishing equipment designed for a wide range of semiconductor and optoelectronic applications. This system is equipped with a high power grinding head and a three-axis linear drive optimization function for precise grinding, lapping and polishing of semiconductor wafers. It also features a unique, integrated two-axis E-beam unit for precise substrates and uniform polishing. The grinding process of GPB-350 is handled by a high power motor with special four-spoke wheel. This wheel is driven by a dual-axis E-beam machine which is near-constant in force and amplitude. The wheel is operated at nominal speed to achieve accurate grinding. The grinding wheel is capable of varied speeds for different types of materials, including hard coatings, ceramics, and glasses, as well as delicate silicon wafers. The lapping and polishing process of OKUMA GPB-350 is provided by a spindle driven grinding head. This head has a 3-axis linear drive optimization function to precisely control the substrate's position. This feature enables better lapping and polishing accuracy, as well as uniform operation regardless of the substrate's position. This head has a maximum speed of 6,000 RPM, which provides fast and efficient lapping and polishing of the wafer. GPB-350 is also equipped with a programmable CNC tool, a high-resolution monitor for image processing, and an auto-stop detection asset. This model enables users to optimize grinding, lapping, and polishing processes with ease. Furthermore, the sequence programming capability of the CNC equipment provides simple and intuitive operation for both experienced and inexperienced users. Finally, OKUMA GPB-350 includes a safety system designed to reduce operator fatigue and enhance operator safety. This unit is comprised of a pressure-guarding machine and an air-purification tool. The pressure-guarding asset prevents dust and debris from entering the model, while the air-purification equipment filters and recirculates the air in the system, keeping the environment clean and safe for the operator. In conclusion, GPB-350 is a wafer grinding, lapping and polishing unit designed to facilitate precise and uniform processing of various types of semiconductor and optoelectronic wafers. Its wide range of features and safety systems make it an ideal solution for various semiconductor and optoelectronic applications.