Used OPTIPRO Pro 80P #293667138 for sale

OPTIPRO Pro 80P is an advanced wafer grinding, lapping and polishing system designed to consistently produce high quality, low-cost products while maximizing productivity and throughput rates. Pro 80P features a 12-position, fully automatic, continuous motion, high-chuck indexing and automatically adjustable rotary chuck. An AC servomotor-driven grinding spindle and a variable-speed spindle drive provide high accuracy, smooth operation and low noise. The system is designed to grind, lap and polish wafers up to 200mm in diameter with high precision. The precision-ground plane carries out precise, automated movements to ensure accurate alignment and accurate grinding, lapping and polishing in all areas. The machine features programmable stone holder positions that allow custom grinding, lapping and polishing angles. The robust OPTIPRO Pro 80P is effective in grinding, lapping and polishing wafer surfaces of any flatness and size. The machine also features an integrated extractor that can be extended or contracted according to wafer size. An optional glass support provides accurate glass loading and verification to ensure no breakage during grinding, lapping and polishing. The machine can operate in both dust-free and wet grinding modes that control air flow and vacuum pressure for high-precision machining. Pro 80P is a versatile and user-friendly machine. A color touchscreen allows quick configuration and control of all parameters, including grinding, lapping and polishing settings. An advanced software- guided user interface makes operation smooth and efficient while providing detailed operation and information. Additionally, the machine is manufactured to exacting quality standards for extended performance stability. OPTIPRO Pro 80P is an advanced all-in-one solution for wafer grinding, lapping and polishing that delivers superior accuracy and precision in results. The high-precision, low-noise machine and programmable stone holder system make Pro 80P an ideal choice for wafer processing.