Used OPTIPRO UFF #9161017 for sale

OPTIPRO UFF is a wafer grinding, lapping and polishing equipment designed to meet the stringent requirements of today's semiconductor industry. The machine allows for precise and efficient processing of a wide variety of wafers, ranging from those with low K values such as silicon to those with high K values such as gallium arsenide. The system integrates the latest in CNC grinding, lapping and polishing technology to deliver uncompromising performance, repeatability and reliability. The unit's grinding stage features a top-of-the-line 5-axis CNC spindle that is specially designed for grinding wafers. The spindle's angle of attack and speed can be adjusted to ensure uniform and accurate grinding. The spindle is also equipped with Diamond Impregnated Grinding Wheels to achieve micro-scale roughing and finishing results. This integrated grinding technology allows for faster and more precise grinding of micro-structured surfaces. The lapping process utilizes a CNC dual head lap machine with up to twelve individually regulated abrasive segments for consistent, repeatable results. The lapping head has a high-speed rotational speed (up to 24,000 RPM) and large stroke range (up to 2 mm) for optimized wafer surface immaculacy. The lapping tool also incorporates a pressure control asset for achieving uniform lap force across the wafer surface, which ensures consistent and reliable results. The polishing stage deploys a pneumatically driven grinding/polishing head to achieve the highest possible surface quality. The grinding/polishing head has a large stroke range (up to 5 mm), high-speed rotational speeds (up to 72,000 RPM) and a pneumatically controlled pressure model for excellent material removal and polishing. In addition, the equipment also includes a state-of-the-art photoguided polishing system that allows for real-time image-based feedback during the grinding/polishing process. UFF also features Autococker which is a unique robotic technology engineered for accurately controlling the entire grinding, lapping and polishing process. Autococker eliminates process variables and ensures consistent and repeatable results. The laser-based vision unit allows for automated wafer identification and orientation and the robotic arm is equipped with advanced gripping technology for a precise and secure wafer transfer. In addition to the Autococker technology, OPTIPRO UFF also includes a number of key application-specific components such as diamond paste holders, diamond lubricants and wafer carriers. These components allow for optimized wafer grinding, lapping and polishing results. UFF is designed to meet the rigorous working environment demands of today's semiconductor industry. It provides a safe working environment, low process noise and low overall power consumption. The machine is easy to use and is also service friendly, thanks to its streamlined design and maintenance integration features. OPTIPRO UFF is a reliable and cost effective machine for creating the highest quality wafer surfaces.