Used OPTOTECH ASM 60 Twin Cut #293591890 for sale

OPTOTECH ASM 60 Twin Cut is a wafer grinding, lapping and polishing equipment designed to meet the precision requirements of the semiconductor industry. This system utilizes a twin cut process which combines the flexibility of full abrasion cut with the speed of a lapping process. The grinding and lapping steps are combined into a single process stage which results in excellent surface finish and high material removal rates. The unit is able to achieve high material removal rates without excessive wear and tear on grinding tools as well as minimal particle generation. The machine can process any wafer size ranging from 6 to 150 mm, with a weight capacity of 10 kg and swing angles of up to +/- 180. It features an individually adjustable platform arrangement, automated tool changeover, and a highly sensitive translation axis control machine. The machine is also equipped with a cooling water supply, a dust exhaust outlet, a sample collecting container and a remote diagnostic control port. The twin cut grinding process is a highly productive and versatile process that enables accurate surface finish and high material removal rates. It utilizes a two-step grinding operation where two grinding disks alternately grind the wafer in two directions. This method results in a more uniform grinding with reduced machining time for high productivity, improved surface finish and reduced grinding forces. ASM 60 Twin Cut uses a SiC abrasive with a high elasticity that ensures uniform, high-precision grinding of the wafer surfaces. This process is also equipped with active cleaning and cooling to protect the previously processed work from debris generated by subsequent grinding. The grinding process takes place in a sophisticated air-flow tool to ensure a high-precision, process-safe environment for the wafer surfaces. The asset also features an advanced automated loading and unloading model which is integrated with the grinding process. This acts as an efficient handling equipment and has proven to reduce loading and unloading time significantly. The ASM 60 can also be integrated with other automated equipment to further reduce human involvement, resulting in shorter cycle times and improved quality of the results. OPTOTECH ASM 60 Twin Cut provides an efficient and cost-effective way to achieve high-precision grinding applications. It is designed to meet the demanding needs of the semiconductor industry and offers excellent throughput and cost savings in high production environment.