Used OPTOTECH ASM 80 #9245053 for sale

OPTOTECH ASM 80 Wafer grinding, Lapping & Polishing Equipment is a multi-functional device which allows for the simultaneous grinding, lapping and polishing of semiconductor and optical wafers. This system offers multiple advantages which include: high-precision, low-vibration, zero-rotation grinding with simultaneous load and unload capabilities as well as user-adjustable speed and pressure settings for customized process optimization. This unit is also designed with an automated centralized lubrication machine for optimal maintenance. Also included with this tool is an intuitive touch-screen interface which allows for easy setup and ease of use. As with most grinding & lapping systems, ASM 80 utilizes diamond or abrasive wheel grinding with a rotating lapping head and specialized fixture for holding the wafers. The asset is capable of processing wafers range from 4-inch (100 mm) and 6-inch (150 mm). The grinding and lapping head delivers a consistent and uniform grinding effect. Furthermore, the wheels are pressure applied via hydraulic pressure and the lapping head is programmed to minimize wafer deformation. Precision abrasion is precisely controlled via user-adjustable process parameters, including rotational speed, feed rate and time allotment, allowing for custom-tailored process optimization. OPTOTECH ASM 80 also includes a wafer polishing unit which uses a rotating platen head and special polishing pad to achieve an even and perfect polish with adjustable pressure and rotation speed. The model includes automated lubrication of all components, assuring uniformity of grinding and polishing across all individual wafers. Cleaning is also automated and integrated to ensure that all surfaces are properly cleaned in between each wafer process and the equipment overall can be remotely monitored for process control and optimization. This system has the ability to process multiple wafers within a single cycle, ensuring fast throughput rates for high-volume production lines. Moreover, it is designed to minimize noise and vibration, allowing the unit to be used in a variety of research and production facilities. Moreover, any parts or components can be easily serviced and replaced by user-friendly maintenance process as all components are built to exact technical specifications and are designed for long-term performance. Overall, ASM 80 Wafer grinding, Lapping & Polishing Machine is the best in its class and provides highly efficient and reliable production capabilities for a range of industrial applications. In addition to its automated functions, this tool is user-friendly and designed for cost-effective use and minimal maintenance.