Used OPTOTECH ASP-200 #9222446 for sale
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ID: 9222446
Vintage: 2006
CNC-D Polishing machine
Option: POLyCAM-3D
Operating system: Microsoft windows
Interfaces: USB & ethernet
Working range: ø10-250 (300) mm
X-Axis:
Axis orientation: Horizontal
Travel: 360 mm
Repeatability: ± 0.001 mm
Feed rate: 0 - 7500 mm / Min
Y-Axis:
Axis orientation: Horizontal
Travel: 120 mm
Repeatability: ± 0.001 mm
Feed rate: 0 - 7500 mm / Min
Z-Axis:
Axis orientation: Vertical
Travel: 100 mm
Repeatability: ± 0.001 mm
Feed rate: 0 - 7500 mm / Min
C-Axis:
Axis orientation: Work piece spindle
Travel: 360°
Repeatability: ± 5”
Feed rate: 0 - 3000° / min
Tool spindle:
Spindle power: 2 kW
Spindle speed: 0 - 4000 rpm
Clamping: HD-Chuck Ø 25
Work piece spindle:
Spindle power: 2,2 kW
Spindle speed: 0 - 2000 rpm
Clamping: HD-Chuck Ø 25
CNC Controller: SIEMENS Sinumerik 840 digital solution line
2006 vintage.
OPTOTECH ASP-200 Wafer Grinding, Lapping and Polishing equipment is designed to deliver high precision and accuracy in wafer grinding, lapping, and polishing processes. It offers a high degree of process capability by combining precision positioning techniques, modern technologies, and an innovative design. The system is equipped with a range of features that enable the efficient machining of wafers. These include a precision motor control unit, a powerful servo motor machine, and a fully automated programmable component handling tool. The asset offers high speed and high accuracy movements as it is able to make movement just one nanometer at a time, allowing for precise results. Additionally, the model offers a wide range of control options, including automated settings for moisture and temperature, as well as manual overrides for additional control. The servo motor equipment provides a smooth motion, high accuracy, and precision control of the grinding, lapping, and polishing processes. The system also features a digital compensation module that can be programmed to adjust for any variances in material characteristics or substrates. This ensures an even finish every time. Additional features of ASP-200 unit include user-friendly controls, fast and precise product positioning, and a post-grinding lamination machine that guarantees a uniform, consistent finish. Additionally, the tool is capable of producing the highest quality wafer surface with precise and automated grinding and lapping processes. The asset also ensures a virtually smooth and warp-free wafer surface by providing a highly automated and flexible production process. Overall, OPTOTECH ASP-200 Wafer Grinding, Lapping and Polishing model is an innovative solution to the precision machining of wafers. It provides a powerful solution for grinding, lapping, and polishing, resulting in precise and accurate wafer surfaces. It offers a high degree of control and flexibility for varying parameters and substrates, and offers the highest quality finishes for all types of wafers.
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