Used OPTOTECH ASP 80 DMT #293651482 for sale

OPTOTECH ASP 80 DMT is a fully automated, programmable equipment designed for precision wafer grinding, lapping and polishing of high-performance, high-purity semiconductor and optics devices. The system is used for preparing substrates to the right size, shape and surface finish with minimal waste. The unit combines a precision grinding and lapping unit, a polishing unit and an integrated control machine to provide full automation of the grinding and polishing process. The grinding stage of the process starts with a high-precision robot which uses diamond grinding wheels to reduce the diameter of the substrate to the required size and shape. The robot is configured to ensure a uniform grinding pattern and minimal surface roughness. This is followed by a lapping unit: here, a magnetically driven precision table spins the substrate, while the table is simultaneously fed with diamond suspensions supplies to the grinding and polishing process. This ensures a homogeneous, ultra-flat substrate surface. The polishing stage involves a high-precision polishing unit. This unit is equipped with an abrasive brush, combined with an oscillation feature that helps to deliver even polishing while reducing heat generation and surface damage. The unit is also designed to allow the user to program the polishing parameters and obtain an optimal surface profile. The tool is further equipped with an integrated controller with a computer interface and a digital panel. The controller ensures that the grinding, lapping and polishing processes can be programmed, while the computer interface allows the user to create and modify recipes. The digital panel enables the user to check the current recipe in use and adjust the parameters accordingly. Overall, ASP 80 DMT is a versatile asset that provides precise grinding, lapping and polishing of wafers. The model is suitable for grinding and polishing a variety of substrates including semiconductor, optics and MEMS devices. It is also optimised for use in medium to large production environments, offering the user maximum flexibility and control of the grinding and polishing processes.