Used OPTOTECH ASP 80 Twin A #293825268 for sale

OPTOTECH ASP 80 Twin A is a powerful, automated wafer grinding, lapping, and polishing equipment. This machine is engineered to enable precision grinding, lapping, and polishing of semiconductor wafer substrates. It is capable of producing look-alike surfaces on a range of single- and multi-layer substrates, such as silicon, metal, ceramic, and multiple layers of organic semi-conductors. The system is comprised of two main components: a two-piece lapping device and a grinding spindle. The lapping device utilizes two diamond lapping plates, one for grinding and lapping operations, and one for polishing operations. The lapping device is mounted on a precision spindle, allowing for precise control of the grinding, lapping, and polishing processes. This spindle can be operated manually, or controlled via the integrated computer interface. The lapping plates are designed to maintain a specific distance between the lapping and grinding surfaces, which can be adjusted according to the need of the substrate. Additionally, the lapping device is equipped with a holder for substrates up to 300 mm in diameter. The machine is also equipped with a grinding spindle, enabling abrasive wheels to be used while grinding and lapping. The spindle is equipped with a speed governing unit, allowing for fine-tune control of the speed of the grinding process. ASP 80 Twin A is equipped with automated polishing capabilities, providing a smooth post-processing finish. The polishing process utilizes a roller polishing wheel, which can adjust the hardness, speed of rotation and pressure applied to the substrate in order to customize the polishing process according to the needs of the substrate. In addition, the machine is equipped with a pressure sensor, enabling precise control over the force applied to the substrate during the polishing process. Overall, OPTOTECH ASP 80 Twin A wafer grinding, lapping, and polishing tool is designed to provide efficient and accurate processing of a wide range of substrates. Its automated capabilities, precise control of the grinding, lapping, and polishing processes, and its upgrades such as the pressure sensor and polishing wheel provide the user with powerful and versatile production capabilities. This asset is an excellent choice for anyone in need of high-precision, automated processing of semiconductor wafer substrates.