Used OPTOTECH ASP 80 #293630513 for sale

OPTOTECH ASP 80 is an advanced wafer grinding, lapping and polishing equipment engineered to process wafers up to 800 mm in diameter. It is a fully automated system that can be used to process a wide range of materials, including all types of semiconductor, ceramic, sapphire and metals. The unit includes an integrated machine of equipment, controls, and software that allows for fast, accurate processing of the wafers. The integrated tool of ASP 80 provides the user with a wide range of processing options. The grinder, ripper, and polisher are designed to process the wafers quickly and accurately. The grinding stage consists of a precision spindle and an ultra-precise optical detection asset that is used to accurately position the substrate. The grinding head is powered by an AC servomotor and is capable of providing sub-micron accuracy. The grinding, lapping, and polishing phases all use diamond abrasive technology in order to provide an extremely high quality, consistent finish. The lapping process is performed using a lap wheel and lap compound. The lap wheel is equipped with a series of articulated arms and a synchronous motor which allows for precise control of the lap wheel speed. The lap compound is a slurry which is added to the lap wheel to help provide a consistent finish. The polishing stage consists of a CMP polishing head and a slurry dispensing model. The polishing head is capable of providing a precise control over the polish rate, allowing for accurate and consistent results. To finish the process, a microscope is used for inspection. A diamond-embedded foam pad is used to provide a uniform finish. OPTOTECH ASP 80 is a powerful, easy to use equipment that can provide precise, repeatable wafer grinding, lapping and polishing. The integrated system of ASP 80 allows the user to quickly and accurately process wafers up to 800 mm in diameter. The unit is backed by a three-year warranty and is the perfect choice for high-precision, reliable wafer processing.