Used OPTOTECH ASP 80 #293778602 for sale

OPTOTECH ASP 80 is a wafer grinding, lapping, and polishing machine that is used to create highly precise surfaces on wafers to produce next-generation semiconductor parts. It provides a consistent and reliable way to achieve smoother surfaces and superior surface characteristics with superior flatness, tight layers, and improved resistance to contamination, which is essential for microelectronic device performance. ASP 80 is designed for both single side and double-sided grinding, lapping, and polishing of wafers up to 300 mm in diameter. The machine is powered by a special motor which enables it to carry out continuous, automatic cycle grinding and multiple station in-process grinding, with precise control over grinding pressure, material feed, and speed. The equipment features two separate grinding, lapping, and polishing modules, both of which are independently adjustable. These modules are designed for a wide range of materials, including SiC, diamond, quartz, and ceramics. In addition, the machine is equipped with an integrated AC and DC power supply, vacuum system, and a precise servo and stepping motor control unit. The machine is automated and programmable, with a precise built-in microprocessor that controls grinding cycle time, and wafer speed, allowing the user to set and control the grind parameters. This ensures the desired results, even when operating on difficult materials. A variable grit size diamond grinding plate and a variable grit polish plate are used to provide the exact finish and surface texture desired. The machine also includes several safety features, such as an E-stop button and interlocks. The tool is designed for quick setup and changeover. It features a wide range of interchangeable grinding, polishing, and lapping plates, as well as a variety of different diamond and abrasive polishing discs. For higher performance, it offers an ultra fine grinding/polishing/lapping option that removes surface defects as small as one-half micron. The machine also comes with a touchscreen control asset for easy operation and monitoring. In summary, OPTOTECH ASP 80 wafer grinding, lapping, and polishing model is an advanced equipment designed to provide superior surfaces for a wide variety of microelectronic parts. Its automated, programmable design and wide range of interchangeable components make it a powerful, efficient, and reliable tool for creating highly precise surfaces across a wide range of materials.