Used OPTOTECH EasyTwin #9395912 for sale

OPTOTECH EasyTwin is a wafer grinding, lapping and polishing equipment specifically designed for research and industrial applications. The system delivers high precision results with repeatability. It combines two wafer grinding systems for optimal performance. EasyTwin allows for tailored grinding and polishing, and fine finishing of the wafers. OPTOTECH EasyTwin utilizes a unique combination of grinding devices and two processing stages. In the first stage, the wafer is mounted to a grinding dish, and a grinding wheel is used to grind down the wafer's surface. This process accounts for approximately 30 percent of the total process time required. The second stage used in the process is the lapping and polishing stage. During this process, a polishing pad is mounted to the grinding dish and a polishing compound is applied onto the polishing pad. This process removes more than 99 percent of the total surface roughness. EasyTwin unit also offers a number of versatile features, including; a compound feeder for uniform and consistent polishing, a sample disk for quick sample recovery after the grinding procedure, a separately controlled tilting table, and vibration dampening to reduce noise and vibration levels. This machine also features a user-friendly graphical user interface (GUI) for controlling and monitoring the process. OPTOTECH EasyTwin is ideal for either short-run production batches or continuous operation. It has the capability of producing wafers with a smooth surface and excellent uniformity. Additionally, its low noise and low vibration levels make it perfect for many clean room applications. In conclusion, EasyTwin is an efficient and economical wafer grinding, lapping and polishing tool, designed for research and industrial applications. It combines two grinding systems for optimal performance and the GUI makes it easy to control and monitor the process. Additionally, its low noise and vibration levels mean that it is perfect for clean room applications.