Used OPTOTECH SM 40 #9022147 for sale

OPTOTECH SM 40 is a top-of-the-line wafer grinding, lapping and polishing equipment that offers a wide range of capabilities for circuit board and semiconductor processing. SM 40 is designed for high-throughput production in the demanding environment of semiconductor production. It features a robust stainless steel housing for long-term durability and a high performance motor for flawlessly grinding, lapping and polishing wafers. OPTOTECH SM 40 is capable of handling up to 6 wafers at a time within a temperature range of -10°C to 140°C. This system can be configured to accommodate a variety of wafer sizes and configurations. SM 40 unit has an advanced closed-loop machine for precise control of wafer grinding and polishing. This tool utilizes PLCs to monitor the grinding pressure, temperature and current parameters for each wafer and adjusts them accordingly for a consistent cycle time and smooth polishing. Additionally, a sophisticated digital closed-loop control asset allows for tight control of the grinding parameters such as the speed and pressure of the grinding wheel. OPTOTECH SM 40 model is equipped with a specialized dust collection equipment that captures dust particles before they can contaminate the wafer. The dust collection system ensures a clean and safe working environment by controlling the dust levels in the work area and preventing contamination in the air or on the wafers. This unit also comes with comprehensive safety features such as an E-stop button, a power failure feature that automatically shuts down the motor when it detects an abnormal situation, and a manual emergency stop switch. In the event of an accident, SM 40 is equipped with an automatic wafer retrieval machine that can quickly return the wafers to their original position. In addition, OPTOTECH SM 40 is compliant with international safety regulations and is supported by OPTOTECH world-class service team. With a broad range of features and capabilities, SM 40 is an ideal solution for high-precision wafer grinding, lapping, and polishing.