Used OPTOTECH Torilab X1 #9294561 for sale

OPTOTECH Torilab X1 is a comprehensive equipment for wafer grinding, lapping, and polishing, providing innovative solutions for a wide range of applications. The system comes with a fully automated front-end that reads in lot-size patterns with up to 800 individual pieces, allowing for direct and efficient grinding and polishing of larger wafers. The X1 comprises a grinding and lapping unit (GRU), four grinding heads, and a polishing chamber, allowing multiple concurrent processing while freely controlling process parameters. The unit is able to produce parts with superior surface finish and higher-accuracy through the use of precision-made bodies, avoiding the damage caused by traditional manual grinding and lapping. The machine is equipped with the latest grinding technology, giving the user control over the entire process. The GRU offers a variable grinding speed, allowing for higher-precision machining. The unit also has a dynamically-adjustable pressure tool which guarantees practically equal pressure along the grinded surface. This feature ensures that all pieces maintain the same thickness, avoiding any discrepancies and the risk of cracking. The linear motion of the GRU is coupled with a closed-loop feedback control which ensures that the motion stays within the optimal parameters, for higher operational safety. The adjustable pressure and force of the pressure rollers enable precise control over the grinding and lapping process. The force of the rollers is modulated in accordance with the process requirements, allowing for higher efficiency and lower grinding process times. The polishing unit includes two independent chambers - one to hold the spindle-mounted polishing cloths and one to contain the polishing fluid, allowing for more effective abrasive particles polishing. The machine is also equipped with a disposable polishing cloth cleaning unit, reducing the laborious manual cleaning and extending the lifetime of the polishing cloths. The asset is able to yield superior-quality grinding and lapping processes even on lots with high piece variations. The model is programmed according to these variations, allowing for fine tuning of the pressure and force during the process. The X1 offers users a reliable and efficient solution for their wafer grinding, lapping, and polishing needs.