Used OWC WSS-RT #9183673 for sale

OWC WSS-RT
ID: 9183673
Saver reclaim tank Includes: Non-clogging Non-drip spout.
OWC WSS-RT is an advanced machine for wafer grinding, lapping and polishing operations. It is a multi-axis robotic cell featuring a six-axis robotic arm, an integrated workholding equipment, a variety of lapping & polishing heads and accessories, as well as a broad range of process parameters for controlling lapping & polishing operations. The capability of WSS-RT for effectively grinding, lapping and polishing wafers of different sizes is enhanced by its flexible operation. It can handle a variety of workpiece sizes and abrasive media, which can be customized according to specifications. This versatility, as well as the machine's multi-axis robotic movement, provides for high-precision results with reduced scrap rates. The machine also has the ability to quickly adjust to different operators. Additionally, to enhance productivity, OWC WSS-RT is equipped with a fully automated loading and unloading system that is simple to use. WSS-RT is equipped with a 6-axis robotic arm, allowing for a wide range of robot motion. The robot's flexibility enables it to quickly complete the required grinding, lapping and polishing operations with extreme precision. It can also move freely between different process parameters during operation, and its intelligent motion control unit guarantees a smooth functioning. Additionally, OWC WSS-RT is enhanced with a variety of lapping and polishing heads, as well as other accessories. The wide range of lapping and polishing heads make it possible to achieve different results on different types of wafers. These heads can also be customized to your specific requirements and mounted on the robot arm according to your needs. The various accessories, such as a programmable timer, feedback temperature monitoring, an adjustable speed drive, and adjustable operating temperature, can also be used to customize the machine's operation to your needs. Overall, WSS-RT is an advanced multi-axis robotic machine for efficient wafer grinding, lapping and polishing operations. Its multi-axis robotic movement and various lapping and polishing heads, as well as accessories, provide for high precision while reducing scrap rates and increasing production speeds. The flexibility of its operation and its automated loading and unloading tool make it ideal for numerous grinding, lapping and polishing processes.
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