Used PASSION 9435-301 #9183402 for sale

PASSION 9435-301 is a powerful automated wafer grinding, lapping and polishing equipment designed for preparing and finishing high quality single and double-side wafers. It is built with a robust and rigid frame for extreme accuracy and repeatability. The system is capable of removing material from the top surface of the wafer while also creating a uniform, mirror-like finish. It can accommodate a range of wafer sizes ranging from 200mm to 12" diameter, and is designed to work with both standard wafers as well as fused silica and semiconductor substrates. The grinding and polishing unit is operated through a central control panel, which allows operators to adjust parameters for various wafer processing operations. The machine has two spindles for grinding and polishing as well as a feeder for supplying wafers. The feeder has an adjustable speed range of 0 to 1500 mm per minute for efficient handling of both large- and small-size wafers. The tool is also equipped with a continuous circulating water asset to keep the grinding and polishing surfaces lubricated and cool. The model's advanced computerized equipment not only allows operators to program the system for responsive processing, but also provides valuable information regarding the state of the wafer in real time (such as temperature, pressure, speed and special notes). It also allows users to view recorded wafers from a distance using an optional software package. The actuator holds two tools simultaneously for double-side processing of wafers. The grinding and polishing tools are manufactured with advanced materials for smooth finishing. The unit also includes several finishing fixtures which allow the polishing pad to rub on the wafer face and edge. In addition, the machine contains a single-point depth control valve to regulate the lapping pressure for each wafer to yield precise results. 9435-301 also includes safety features such as an emergency stop button and interlocking covers to reduce operator injury risks. Other features include a dust collector to reduce the amount of fines generated during grinding and polishing and an environmental control tool to minimize environmental disturbances caused by the wafer process. The asset also includes a range of signals and alarms to keep operators informed of machine status, wafer processing progress and other live feedbacks. In summary, PASSION 9435-301 is a highly advanced automated wafer grinding, lapping and polishing model designed to deliver precise and repeatable results. It is equipped with sophisticated features such as a central control panel, advanced computerized systems, two spindles, a feeder, a continuous circulating water equipment, safety features, a dust collector, and an environmental control system. All of these components work together to provide a safe and efficient unit for preparing and finishing high quality wafers.