Used PETER WOLTERS AC 1200F #9241963 for sale

PETER WOLTERS AC 1200F is a precision wafer grinding, lapping, and polishing machine used to achieve the highest degree of accuracy, surface quality, and throughput rate in the grinding, lapping, and polishing processes. This machine is designed specifically for the production of wafers used in the electronics industry, producing a superior level of accuracy with no contaminants. AC 1200F has several features to enable efficient operation and reliable results. It utilizes a flexible cross-slide equipment that allows for easy positioning of the grinding and polishing tools. This system helps prevent downtime as it can be used with interchangeable end-effector tools, allowing for various grinding and polishing processes to be done in a single machine. The precise manual and automatic settings available on the unit enable the user to control the grinding speed and depth with high accuracy. The machine is equipped with a spindle and motor, which have a high rotational speed of up to 4500 revolutions per minute. For further refinement, the machine can be fitted with a pulsator, providing precise control over the grinding and polishing processes. The machine is also equipped with a load-sensing unit, which provides information on the load on the end-effector. The unit includes a variable voltage power supply, enabling the user to control the voltage and the frequency of the grinding and polishing process. The robust, durable design of the machine ensures a long service life. In addition, a number of standard features enable easy and precise operation. The central control machine allows the user to program and monitor the grinding and polishing process with ease. To ensure superior results, PETER WOLTERS AC 1200F utilizes an advanced diamond lapping process with stainless steel lapping surfaces for efficient and reliable grinding, lapping, and polishing. This tool ensures that the finished product achieves the highest levels of accuracy and surface quality. The diamond lapping surfaces have a high level of abrasion resistance and are designed to withstand wear and tear from extended use. Overall, AC 1200F is a precision wafer grinding, lapping, and polishing machine that enables the user to achieve the highest levels of accuracy and surface quality. The flexible control asset and highly durable design ensure the machine can be used for a long period of time and delivers superior performance. This machine facilitates the production of wafers that meet the highest standards of accuracy and reliability.