Used PETER WOLTERS AC 1500-L MicroLine #9103899 for sale

PETER WOLTERS AC 1500-L MicroLine is an advanced wafer grinding, lapping and polishing system designed to meet the stringent demands of today's modern semiconductor industry. The machine utilizes a powerful rotary axis that is capable of delivering flexible solutions for precision grinding, lapping and polishing of substrates such as silicon, gallium arsenide and germanium. The AC 1500-L features a high-precision four-axis computer numerically controlled (CNC) machine which allows for precise control over grinding, lapping and polishing operations. The machine has an intuitive user friendly interface which allows for easy programming and machine settings. The machine can process a range of different materials including aluminum, stainless steel and ceramics. The machine has a large assortment of attachments available for various operations. These attachments include a range of different size grinding plates, polishing and lapping discs, and diamond tooling. The AC 1500-L also features a range of additional accessories such as chucks, deflectors, support stands and articulating throats. The grinding plates are optimized for a range of different substrates and are available in different sizes. The plates are easily mounted and secured on the machine's spindle. The polishing discs feature a grit size optimized for the substrate being worked on and are available in different sizes. The lapping discs feature a wider range of grit sizes for the more demanding polishing and lapping applications. The AC 1500-L utilizes a powerful motor with low vibration levels that provides silent and reliable operation. The machine is also equipped with a cooling system which prevents the motor from overheating and ensures that the grinding, lapping and polishing operations are performed accurately and quickly. The AC 1500-L also includes a range of safety features designed to protect operators from debris and working with hazardous materials. The machine is designed to comply with industry guidelines and standards for safety and has been tested under extreme conditions. The AC 1500-L wafer grinding, lapping and polishing system is an advanced and reliable machine for processing substrates such as silicon, gallium arsenide and germanium. The machine utilizes an intuitive user-friendly machine interface and is capable of delivering precision grinding, lapping and polishing operations. The machine includes a range of attachments and accessories such as chucks, deflectors, support stands and articulating throats for various operations. The machine is also equipped with safety features and is designed to comply with industry standards for safety.