Used PETER WOLTERS AC 319 #9258311 for sale

PETER WOLTERS AC 319 is a high-precision wafer grinding, lapping, and polishing equipment that provides a comprehensive solution for pre-silicon semiconductor wafer processing. This advanced system provides high-quality grinding and polishing of wafer surfaces with a large working swing diameter of 250 mm. The unit is well-suited for high-precision single-side and double-side grinding, lapping and polishing processes due to its flexible and precise operation parameters. AC 319 is equipped with an enhanced, high-performance three-axis servo machine and CNC (Computer Numerical Control) interface, ensuring the highest precision control and accuracy during wafer processing. An 11" touch screen graphical user interface (GUI) enables easy operation. The tool also features RS232 communication ports for external asset networking. PETER WOLTERS AC 319 uses a comprehensive range of grinding wheels featuring diamond or cBN abrasives and featuring different grain sizes and shapes, providing the user with maximum flexibility when grinding and polishing a wide variety of materials and substrates. The model is also capable of working on hard materials such as quartz and carbide. To facilitate efficient cleaning and maintenance, AC 319 features a self-adjusting front cabinet, offering access to the interior parts, including the grinding and polishing wheels, for cleaning and replacement. A semi-automatic wheel dressing equipment allows the user to select the desired dressing parameters with the touch of a button. Additionally, the system also includes a zero-point centering device ensuring precise centering of new wheels and maximizing the wheel's life span. PETER WOLTERS AC 319 has a working range of ±135° in X and, and ±180° in Y axes, allowing access to the full working range of the grinding wheel during processing. An intuitive, powerful software control package allows users to save and recall the grinding and polishing programs for efficient operation. In summary, AC 319 is an advanced, high-precision wafer grinding, lapping, and polishing unit designed for pre-silicon semiconductor wafer processing. It offers a comprehensive range of features, including a three-axis servo machine, CNC interface, touch screen graphical user interface, self-adjusting front cabinet, and intuitive control software.