Used PETER WOLTERS AC 319 #9279433 for sale

PETER WOLTERS AC 319 is a machine used for grinding, lapping, and polishing of semiconductor components and other small parts. It is designed to increase efficiency in precision grinding and polishing processes. The machine is capable of working with silicon wafers, microelectronics and other hard materials. AC 319 utilizes a technology known as Single-Side Polishing (SSP), which is ideal for processing of thin wafers. SSP utilizes a two-step polishing process that firstly removes the substrate material, then secondly precisely smoothens and finish the surface. The two steps are performed separately, each step taking a specific amount of time and force in order to achieve the optimal results. The machine features three grinding heads that are solidly mounted to a balanced three-axis platform. The machine performs grinding, lapping, or polishing depending on what is needed. The head can be rotated and tilted, providing an optimal and versatile working range. The grinding heads are equipped with diamond tools. These offer superior grinding and polishing capabilities due to their firm bond to the material and minimal wear and tear on the diamond particles. The diamond tools can be moved across the sample surface using the axes motor and feeder unit. Designed to provide a uniform material removal, this process increases the surface planarity and reduce surface irregularities. The machine comes equipped with adjustable vacuum zones for wafer clamping as well as a glass elevator system for a controlled surface coverage according to the sample size. Additionally, the machine features a user-friendly PC-controlled user interface with easy-to-understand controls, settings, and instructions. PETER WOLTERS AC 319 features superior engineered motion control systems and programmable logic controllers, allowing for precise, repeatable solutions. Thanks to the advanced automation systems, the parameters can be customized for each job, making it possible to achieve the desired surface finish with a single setup, regardless of material, size, or complexity. AC 319 is an ideal machine for surface processing and polishing of precision components, providing greate accuracy at an affordable cost. This machine is a reliable and cost-effective choice for modern wafer grinding, lapping, and polishing needs.