Used PETER WOLTERS AC 320 #9219528 for sale

PETER WOLTERS AC 320 wafer grinding, lapping & polishing equipment is designed for the high-precision finishing, polishing and grinding of wafers. The system is a fully automated, one-step process for precise fine grinding, lapping and polishing of wafers. It is ideal for cleaning, removing surface roughness and contributing to smooth, pristine surfaces on any wafer. The unit is designed to be flexible, so users can complete multiple passes of grinding, lapping and polishing to enhance the precision and refinement of the surfaces being worked on. It features tool-free work piece and abrasive loading for easy loading, unloading and integration of multiple setups. It has numerous process control options, from manual to fully automated, so users can customize processes to fit their needs. AC 320 is a high-performance, heavy-duty machine, offering maximum loading flexibility, accuracy, and precision for wafer processing. Its highly rigid design and high throughput consistencies makes it uniquely suited for process intensive jobs. The tool is engineered for flexibility, offering programmable, selectable and scalable process parameters. The asset is capable of supporting a range of abrasive media, including diamond, silicon carbide, alumina, and other specialty abrasives for the highest quality results. It can also be used with a variety of fluids, enabling quick and efficient cleaning. All grinding, lapping, and polishing operations are handled via pneumatics, meaning that no manual intervention is required during the process. The model is easy to use and maintain, with intuitive no-tool maintenance and low noise operation. It provides a low cost of ownership, as the cost of the machine is affordable compared to other high performance systems. Its reliability and dependability also make it a suitable choice for multiple and long-running operations. In summary, PETER WOLTERS AC 320 wafer grinding, lapping & polishing equipment offers precision, rigidity and flexibility for all types of wafer processing. It is fully automated, easy to use and maintain, and is cost effective compared to other options. Its multiple process control options make it customizable to fit any operation�s needs, and its selection of abrasive media makes it ideal for any job.