Used PETER WOLTERS AC 320 #9232345 for sale
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ID: 9232345
Double sided lapping machine
Includes:
Principal machine
Monitor
Electronic box.
PETER WOLTERS AC 320 is a leading precision wafer grinding, lapping and polishing equipment, designed to achieve remarkable flatness, parallelism and surface finish. This system provides a reliable and efficient solution for a variety of wafer prepping and processing applications, including backside grinding, wafer fine-tuning, and front-side polishing. AC 320 unit is equipped with an efficient and precise Planetary Lapping & Polishing Head Machine, which provides the necessary mechanical energy to produce top-quality wafers. This tool includes a loader/ unloader, which is integrated with the Planetary Lapping & Polishing Head Asset, providing quick setup and changeover for a variety of wafer sizes. The flexible and powerful Planetary Lapping & Polishing Head Model is used in combination with tools and consumables such as grinding balls and polishing pads. In addition to the Planetary Lapping & Polishing Head Equipment, PETER WOLTERS AC 320 provides a high-precision CNC-controlled grinding head and an advanced micro-scratch detector. The high-precision CNC-controlled grinding head is used to define the grinding parameters, including the grinding speed and the accuracy, as well as to guarantee a consistent and repeatable grinding process. The advanced micro-scratch detector ensures reliable wafer surface finish measurements and provides the necessary feedback for a rapid process optimization. AC 320 also provides a highly integrated thermal system, which enables temperature stability during the grinding, lapping and polishing processes. This thermal unit guarantees fast and reliable wafer temperature equilibrium. Moreover, this machine includes a comprehensive process monitoring tool, which provides real-time process information and Machine-Operator Interface. Overall, PETER WOLTERS AC 320 asset is an efficient and reliable wafer processing solution. Thanks to its high-precision grinding head, advanced micro-scratch detector, integrated thermal model, and comprehensive process monitoring equipment, this system is capable of providing top-level wafer processes with outstanding accuracy and rapid turnaround.
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