Used PETER WOLTERS AL00 1L #9199604 for sale

PETER WOLTERS AL00 1L is a fully-automated wafer grinding, lapping, and polishing equipment designed to ensure both accuracy and repeatability for processing of master and test wafers for a variety of applications such as semiconductor and optoelectronic components. The system features a user-friendly touch screen LCD control panel and a fully enclosed work chamber for a clean and safe environment during the processing of the wafers. AL00 1L is equipped with a robust and reliable main grinding/polishing spindle that provides high precision machining together with a rapid repeatability and a reliable grinding/lapping process that guarantees an excellent surface finish on both sides of the wafer. This spindle has also been designed to operate with a wide range of grinding/polishing tools ranging from diamond wheels and lapping films to mechanical polishing tools, ensuring a consistent and high-quality result. The unit also includes a cassette-to-cassette wafer handling machine that utilizes vacuum to securely transport the wafers to the spindle without the risk of contamination or scratching during transport. The robot arm is equipped with integrated sensors for material recognition to optimize the process of changing the cassettes and ensure the correct selection of wafers for the grinding/lapping process. The tool can be configured with a variety of wafer sizes and substrates from 5" to 8" in diameter with a maximum load capacity of 1Kg and an outside radius of 10mm. It also features an integrated process control asset that enables the user to monitor and adjust the process parameters for the grinding and polishing process. PETER WOLTERS AL00 1L is designed with a full view of the wafer processing station, allowing the user to check the wafer's surface quality and finish in real-time as the process is in progress. This model can be used for a variety of different materials such as single crystal, double crystal, multi-electrode, and non-conductive materials. AL00 1L is an efficient and accurate wafer grinding, lapping, and polishing equipment that will guarantee repeatable and consistent results.