Used PETER WOLTERS AL1 #152787 for sale

PETER WOLTERS AL1 wafer grinding, lapping & polishing equipment is an efficient way of preparing wafers for further processing in the semiconductor industry. The system incorporates three main sections - the mainframe which houses the grinding, lapping, and polishing stages, the polishing medium, and the automated loading and unloading unit. The mainframe of the machine has three stages, each providing unique functionality for the surface finish of the wafer. The first stage is a continuous feed grinding process which provides a planar finish. During this grinding process the rotating abrasive discs grind and polish the wafer surface removing any surface imperfections. The second stage consists of a lapping process which polishes the wafer surface using high-precision alignment systems. Both these grinding and lapping operations are designed in such a way that the wafer surface is within 3 to 6 microns of precision. The final stage of processing is the polishing stage which is done using either high-pressure jets or special polishing pads. This stage ensures that the surfaces of the wafer are smooth and mirror like. During the polishing process for every kind of material a unique polishing media is introduced with the help of various injectors. This polishing media helps to improve the surface finish and also enhances the optical quality of the wafer. The automated loading and unloading section helps to increase the tool's efficiency and productivity. This section is designed to optimize the asset's utilization rate, reducing manual labor and providing a consistent flow of wafers within the model. The automated loading and unloading equipment makes sure that the right amount of time is allocated for each stage of the polishing process and that there is no overload of work on the processing units. Overall, PETER WOLTERS AL-1 wafer grinding, lapping & polishing system is a highly efficient method to prepare wafers for further processing in the semiconductor industry. The automated loading and unloading section ensures the unit is utilized to the best possible rate and the three stage operation ensures a high level of precision and surface finish.