Used PETER WOLTERS AL2 #131879 for sale
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ID: 131879
Wafer Size: 8"
Vintage: 1988
Grinder, 8"
For silicon wafers
Wheel diameter: 1010 mm
Career diameter: 310 mm
(7) Careers
Power supply: 380/220 V, 50 Hz
1988 vintage.
PETER WOLTERS AL2 is a wafer grinding, lapping and polishing equipment, specifically designed to process semiconductor wafers up to 300 mm in diameter. It uses a unique combination of lapping and polishing processes to accurately and quickly finish wafers to a specified thickness and surface roughness. The system is capable of performing all necessary lapping and polishing operations in one fully automated, modular machine. PETER WOLTERS AL 2 is self-contained, meaning all of its components are housed in one machine. Its set up is designed for easy loading and unloading of the wafers to achieve maximum efficiency. The unit's automated lapping process uses two independently-controlled, servo-driven lapping balls that move in a controlled path over the wafers, grinding away the unevenness caused by etching, oxidation and other defects. This process is essential for obtaining precise results in the subsequent polishing operation. The polishing process also takes place automatically. It uses a combination of chemically-treated diamond particles and water to create a gentle surface abrasion, removing any surface irregularities that were created in the lapping process. This results in a precise and uniform surface finish, while preserving the integrity of the wafer's original architecture. The machine also enables the precise selection and control of the surface roughness values. The tool has various safety features to ensure smooth operation. These include a safety guard that prevents the operator from accidentally entering the machine while it is running, as well as an air knife to keep the interior of the machine clear of any particulates created by the processes. AL2 is a reliable and efficient machine, capable of achieving superior results with minimal downtime. It requires minimal maintenance, and provides reliable and repeatable results. It is the ideal machine for tackling a wide variety of grinding, lapping and polishing operations in the wafer processing industry.
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